Ultra-thin Copper Foil
- About 2um to 6um ultra-thin copper foil that becomes the raw material for EMI shielding and FCCL.
- The world’s first copper foil manufactured by electroless chemical copper plating process
Electronic Materials Our thin copper foil manufactured by using the world’s first electroless chemical copper plating process has versatile applications including EMI shielding, FCCL, and radiating film.
Ultra-thin Copper Foil
EMI Shielding Sheet
PET CCL
RTR Manufacturing Facility
Foam thin copper foil for 5G high speed transmission EMI shielding, low roughness, and porosity
Shape
Characteristics of copper foil
Nano-scan Image
Overview of materials for high speed transmission EMI shielding
Roll To Roll Copper Plating
Cu plating uniformity
Items | Min | Max | Average | |
---|---|---|---|---|
Raw Materials | Top | 8.1 | 8.5 | 8.3 |
Bottom | 8.1 | 8.6 | 8.4 | |
After plating | Top | 18.2 | 19.3 | 18.5 |
Bottom | 18.2 | 19.5 | 18.5 |