Soft ENIG Process
- Gold plating process for FPCB
- Can implement ultra-fine circuit
- Excellent folding endurance
- Reduce nickel cracks
Final Surface Treatment The process used for the final treatment of electronic materials such as PCB and semi-conductor. It mainly uses chemical materials such as gold, silver, and palladium for jewelry plating.
Soft ENIG Process
ENEPIG Process
Soft ENIG Process : CF300-10 series / MIKO series
Features
Pretreatment
Soft EN : CF300-10 series
Immersion Gold :
Miko series
After 50 cycle-bending
Pd-P(ELP series) or Pure Pd(ZEP series) ENEPIG Process
Features
Plating process
Electrolytic Gold Process : HG300 & SAU10 series
Hard gold process features
Plating process
Cleaner
Etching
Acid Dip
Bright Ni
Acid Dip
Au Str.
Au
Soft gold process Features